Thermal/Traffic-aware 3D Network-on-Chip (NoC) Designs
An-Yeu (Andy) Wu, National Taiwan University
Current multicore architectures formed by tens of processing cores will be soon replaced by the next generation of manycore architectures with hundreds of cores. In fact, the International Technology Roadmap for Semiconductors foresees that the number of Processing Elements (PEs) that will be integrated into a System-on-Chip (SoC) will be in the order of thousand within the 2020. As the number of communicating elements increases, there is a need for an efficient, scalable and reliable communication infrastructure. As technology geometries shrink to the deep submicron regime, however, the communication delay and power consumption of global interconnections become the major bottleneck. The Network-on-Chip (NoC) design paradigm, based on a modular packet-switched mechanism, can address many of the on-chip communication issues such as performance limitations of long interconnects, and integration of large number of PEs on a chip.
The goal of NoCArc workshop is to provide a forum for researchers to present and discuss innovative ideas and solutions related to design and implementation of multi-core systems on chip. The workshop will focus on issues related to design, analysis and testing of on-chip networks.